PS5 Uses Liquid Metal Cooling - New Patent Info

[Mavrick]

Sony patent for APU liquid metal cooling and Gamernexus saying this is a part of PS5 cooling system

https://patentscope.wipo.int/search/...KDUB59-01124-1

he present invention provides a structure in which a metal having fluidity is utilized as a heat conductive material. In this structure, a heat conductive material is prevented from invading an unintended region even when a positional change of a semiconductor device occurs or a vibration occurs. This electronic apparatus has a heat conductive material (31) formed between a heat radiator (50) and a semiconductor chip (11). The heat conductive material (31) has fluidity at least when the semiconductor chip (11) is in operation. The heat conductive material (31) has electroconductivity. The heat conductive material (31) is surrounded by a seal member (33). A capacitor (16) is covered by an insulating section (15).

Asus are using the same method on their upcoming gaming laptops.

Looks like an isolation walls or a chamber to keep gallium from seeping out from under the heatsink.

For those that don't computer, you need a thermal compound between the heat sink and the processor. Even mirror flat, the bottom of the heat sink still has micro grooves that trap air and air is a very poor thermal conductor. This essentially traps excess heat you could be removing, and we all know heat is the enemy of small closed box consoles. So you use some thermally conductive paste to fill in those cracks and make a nice even bond to the surface of the processor.

Gallium is liquid at room temperature and being a metal has much greater thermal conductive properties over traditional paste they spread under the heatsink. The problem however, is in being a metal, it's electrically conductive and has a tendency to flow like water when warm. This means to use it and have great thermal properties, you have to find a way to deal with the possibility of it leaking out and touching small things like transistors and bridging them. This can short out components on the board and ruin your devices. The patent looks like a way to keep the gallium where it needs to be so you can move and bump the console without worry if it's going to leak and short something.

The invention provides a structure in which a metal having fluidity is utilized as a heat conductive material. This heat conductive material is formed between the heat radiator and the chip.

ELI5, Some invention of utilizing thermal paste where it prevents it from invading an unintended region when a positional change of a semiconductor device occurs/vibration occurs.

https://www.reddit.com/r/PS5/comment..._filed_by_sie/

So this in conjunction with the earlier patent could be the exotic cooling solution they came up with.