PS5 Uses Liquid Metal Cooling - New Patent Info

[Mavrick]

Originally Posted by Steelmaker

I get that but I guess what I'm saying is, the higher clock speeds were necessary due to the lower CU count. The decision to go with a lower CU count...I can only assume was to save on cost. But that saving seems to be somewhat negated by the expensive cooling solution. So what was the point to begin with? I know Cerny said he prefers a fewer/faster CU solution. But does he REALLY? Or was that a bit marketing spin? Are there genuine advantages to that design vs MS' more traditional approach?

The cost of this cooling method isn't that expensive. We're talking dollars to manufacture rather than cents of a traditional cooling method.

I don't know for sure but I'd imagine the savings from using lower CU is greater than the cost of the cooling method.

I think it has more to do with yield also. They should be able to achieve a much better yield on production, it's also possible that CUs could be unlocked if production yield is perfect. But the benefit of an extra 2 CUs could be negligible anyway so might not even be worth the effort.